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 DISCRETE SEMICONDUCTORS
DATA SHEET
OM3105P Hybrid integrated circuits for inductive proximity detectors
Preliminary specification File under Discrete Semiconductors, SC17 January 1994
Philips Semiconductors
Philips Semiconductors
Preliminary specification
Hybrid integrated circuits for inductive proximity detectors
FEATURES * Extra small dimensions (3 x 20 mm max.) * Wide supply voltage range (6 to 35 V) * Supply current typical 1.5 mA (output stage switched off) * High output current (250 mA max.) * RC filter on the supply lines * PNP output transistor protected against transients from the inductive load * Circuit protected against wrong polarity connection of the supply voltage * Electronic short-circuit protection * Detection distance adjustable by a chip resistor (Rd), type 1206 * Only a simple coil in one part is required; e.g. the OM2860 requires a coil in two parts * Hysteresis adjustable by a chip resistor (Rh), type 0603, for using the OM3105P with other then M5 coils * Status of the output is shown by a yellow or red LED mounted on the substrate surface * The OM3105P is also available without a LED, but with an output pad for external LED connection * A version with a NPN output transistor is available (OM3105P). QUICK REFERENCE DATA SYMBOL VB IO fsw Ts PARAMETER DC supply voltage output current operating switching frequency operating substrate temperature VB = 24 V; Ts = 25 C M5 coil CONDITIONS 6 - - -20 TYP. DESCRIPTION
OM3105P
The OM3105P is a hybrid integrated circuit intended for inductive proximity detectors in a tubular construction, especially the M5 hollow stud. The circuit performs a make function (version 1): when actuated, the current flows through the load, which can be for example a LED or an optocoupler. It is also possible to perform a break function when using version OM3115P. Available versions: OM3105P: pnp output; make function OM3115P: pnp output; break function OM3105N: npn output; make function OM3115N: npn output; break function OM31.5./0: for external LED connection.
MAX. 35 250 5 +70 V
UNIT mA kHz C
January 1994
2
Philips Semiconductors
Preliminary specification
Hybrid integrated circuits for inductive proximity detectors
MECHANICAL DATA
OM3105P
20 max 8 3 max 1 0.3 inductive load 3
7 7.75 5
2
4
6
MSA936 - 1
Dimensions in mm. Coil: O 0.063 mm Cu wire, 80 turns. Potcore: 3.3 x 1.3 mm.
Fig.1 Outline and connections.
PAD INFORMATION PAD NUMBER 1 2 3 4 5 6 7 8 output negative supply (-) positive supply (+) coil connection coil connection Rd resistor (type 1206) for adjusting the detection distance Rt resistor (type 0603) for adjusting the stability with temperature variations Rh resistor (type 0603) for adjusting the hysteresis DESCRIPTION
January 1994
3
Philips Semiconductors
Preliminary specification
Hybrid integrated circuits for inductive proximity detectors
LIMITING VALUES Limiting values in accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VB IO Tstg Ts DC supply voltage output current; Ts = 25 C storage temperature operating substrate temperature PARAMETER 6 - -40 -20 MIN. 35 250 +125 +70
OM3105P
MAX. V
UNIT mA C C
CHARACTERISTICS VB = 24 V (DC); Ts = 25 C; unless otherwise specified. SYMBOL IB Vd d PARAMETER supply current voltage drop detection distance CONDITIONS output stage ON output stage OFF IO = 250 mA coil M5 11 1.5 1 0.8 TYP. - - 1.5 - MAX. UNIT mA mA V mm
1.0
MBD233
1.0
MBD235
d (mm)
d (mm)
d off 0.9 d on 0.9
d off
d on
0.8 20 0 20 40 60 Ts 80 (o C)
0.8 6 12 18 24 V (V) 30 B
Fig.2
Switching distance as a function of the substrate temperature.
Fig.3
Switching distance as a function of the DC supply voltage.
January 1994
4
Philips Semiconductors
Preliminary specification
Hybrid integrated circuits for inductive proximity detectors
OM3105P
400 I O max (mA) 350
MBD234
300
250
200
150 20 0 20 40 60 80 Ts (o C)
Fig.4
Overload protection as a function of the substrate temperature.
MOUNTING RECOMMENDATIONS General If a protective cap is incorporated, it should be as thin as possible, because its thickness "d" forms part of the operating distance "S". A brass stud wall should not extend beyond the potcore. The exact value of "S" with its spread is determined by a number of variables, e.g.: value of the adjustment resistor Rx, the oscillator coil, the metal of the actuator, the material and shape of the housing. Soldering recommendations * Use normal 60/40 solder. * Use a soldering iron with a fine point. * Soldering time should be kept to a minimum, not exceeding 2.5 s per soldering point (Tsld = 250 C maximum). * The substrate should preferably be pre-heated to a temperature of 100 C with a minimum of 80 C and a maximum of 125 C. January 1994 5
Potting recommendations First cover the hybrid IC with about 0.5 mm of silicone rubber, let it harden and with the parts inserted in the tube, fill up the tube with epoxy.
d
MSB318
Fig.5 Insertion of potcore in brass tube.
Philips Semiconductors
Preliminary specification
Hybrid integrated circuits for inductive proximity detectors
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
OM3105P
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
January 1994
6
Philips Semiconductors
Preliminary specification
Hybrid integrated circuits for inductive proximity detectors
NOTES
OM3105P
January 1994
7
Philips Semiconductors - a worldwide company
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428) BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367 Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. (02)805 4455, Fax. (02)805 4466 Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213, Tel. (01)60 101-1236, Fax. (01)60 101-1211 Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands, Tel. (31)40 783 749, Fax. (31)40 788 399 Brazil: Rua do Rocio 220 - 5th floor, Suite 51, CEP: 04552-903-SAO PAULO-SP, Brazil. P.O. Box 7383 (01064-970). Tel. (011)829-1166, Fax. (011)829-1849 Canada: INTEGRATED CIRCUITS: Tel. (800)234-7381, Fax. (708)296-8556 DISCRETE SEMICONDUCTORS: 601 Milner Ave, SCARBOROUGH, ONTARIO, M1B 1M8, Tel. (0416)292 5161 ext. 2336, Fax. (0416)292 4477 Chile: Av. Santa Maria 0760, SANTIAGO, Tel. (02)773 816, Fax. (02)777 6730 Colombia: Carrera 21 No. 56-17, BOGOTA, D.E., P.O. Box 77621, Tel. (571)217 4609, Fax. (01)217 4549 Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. (032)88 2636, Fax. (031)57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. (9)0-50261, Fax. (9)0-520971 France: 4 rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. (01)4099 6161, Fax. (01)4099 6427 Germany: P.O. Box 10 63 23, 20095 HAMBURG , Tel. (040)3296-0, Fax. (040)3296 213 Greece: No. 15, 25th March Street, GR 17778 TAVROS, Tel. (01)4894 339/4894 911, Fax. (01)4814 240 Hong Kong: 15/F Philips Ind. Bldg., 24-28 Kung Yip St., KWAI CHUNG, Tel. (0)4245 121, Fax. (0)4806 960 India: PEICO ELECTRONICS & ELECTRICALS Ltd., Components Dept., Shivsagar Estate, Block 'A', Dr. Annie Besant Rd., Worli, BOMBAY 400 018, Tel. (022)4938 541, Fax. (022)4938 722 Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4, P.O. Box 4252, JAKARTA 12950, Tel. (021)5201 122, Fax. (021)5205 189 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. (01)640 000, Fax. (01)640 200 Italy: Viale F. Testi, 327, 20162 MILANO, Tel. (02)6752.1, Fax. (02)6752.3350 Japan: Philips Bldg 13-37, Kohnan 2 -chome, Minato-ku, KOKIO 108, Tel. (03)3740 5101, Fax. (03)3740 0570 Korea: (Republic of) Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. (02)794-5011, Fax. (02)798-8022 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. (03)757 5511, Fax. (03)757 4880 Mexico: Philips Components, 5900 Gateway East, Suite 200, EL PASO, TX 79905, Tel. 9-5(800)234-7381, Fax. (708)296-8556 Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Tel. (040)78 37 49, Fax. (040)78 83 99 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. (09)849-4160, Fax. (09)849-7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. (22)74 8000, Fax. (22)74 8341 Pakistan: Philips Markaz, M.A. Jinnah Rd., KARACHI 3, Tel. (021)577 039, Fax. (021)569 1832 Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc, 106 Valero St. Salcedo Village, P.O. Box 911, MAKATI, Metro MANILA, Tel. (02)810 0161, Fax. (02)817 3474 Portugal: Av. Eng. Duarte Pacheco 6, 1009 LISBOA Codex, Tel. (01)683 121, Fax. (01)658 013 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. (65)350 2000, Fax. (65)251 6500 South Africa: 195-215 Main Road, Martindale, P.O. Box 7430,JOHANNESBURG 2000, Tel. (011)470-5433, Fax. (011)470-5494 Spain: Balmes 22, 08007 BARCELONA, Tel. (03)301 6312, Fax. (03)301 42 43 Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM, Tel. (0)8-632 2000, Fax. (0)8-632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. (01)488 2211, Fax. (01)481 7730 Taiwan: 69, Min Sheng East Road, Sec 3, P.O. Box 22978, TAIPEI 10446, Tel. (2)509 7666, Fax. (2)500 5899 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 60/14 MOO 11, Bangna - Trad Road Km. 3 Prakanong, BANGKOK 10260, Tel. (2)399-3280 to 9, (2)398-2083, Fax. (2)398-2080 Turkey: Talatpasa Cad. No. 5, 80640 LEVENT/ISTANBUL, Tel. (0212)279 2770, Fax. (0212)269 3094 United Kingdom: Philips Semiconductors Limited, P.O. Box 65, Philips House, Torrington Place, LONDON, WC1E 7HD, Tel. (071)436 41 44, Fax. (071)323 03 42 United States: INTEGRATED CIRCUITS: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556 DISCRETE SEMICONDUCTORS: 2001 West Blue Heron Blvd., P.O. Box 10330, RIVIERA BEACH, FLORIDA 33404, Tel. (800)447-3762 and (407)881-3200, Fax. (407)881-3300 Uruguay: Coronel Mora 433, MONTEVIDEO, Tel. (02)70-4044, Fax. (02)92 0601
For all other countries apply to: Philips Semiconductors, International Marketing and Sales, Building BAF-1, P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands, Telex 35000 phtcnl, Fax. +31-40-724825 SCD27 (c) Philips Electronics N.V. 1993
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
9397 726 50011
Philips Semiconductors


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